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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Shichun Qu,Yong Liu

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

by Shichun Qu,Yong Liu


ISBN 13: 9781493915552

Format: Illustrated (342 pages)
Publisher: Springer
Published: 11 Sep 2014

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New : $177.59